发明名称 |
LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREFOR, AND BACKLIGHT UNIT INCLUDING LIGHT SOURCE MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide an edge system backlight unit which is made slim by mounting a light-emitting diode chip in parallel with a light guide plate, with regard to a light source module and a manufacturing method therefor, and a backlight unit including a light source module.SOLUTION: A light source module includes a light-emitting diode chip connected electrically with a substrate via the bottom surface, a wavelength conversion part including the emission surface of light of the light-emitting diode chip on one side face thereof, and formed on the light-emitting diode chip while including at least the emission surface, and a reflection part formed on the light-emitting diode chip except the emission surface. |
申请公布号 |
JP2015070273(A) |
申请公布日期 |
2015.04.13 |
申请号 |
JP20140196808 |
申请日期 |
2014.09.26 |
申请人 |
SEOUL SEMICONDUCTOR CO LTD |
发明人 |
NAM KI BUM;JUNG SEOUNG HO;HAN YU DAE;LEE CHUNG HOON;CHOI HYUCK JUNG |
分类号 |
H01L33/60;F21S2/00;G02F1/13357;H01L33/50 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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