发明名称 LIGHT SOURCE MODULE AND MANUFACTURING METHOD THEREFOR, AND BACKLIGHT UNIT INCLUDING LIGHT SOURCE MODULE
摘要 PROBLEM TO BE SOLVED: To provide an edge system backlight unit which is made slim by mounting a light-emitting diode chip in parallel with a light guide plate, with regard to a light source module and a manufacturing method therefor, and a backlight unit including a light source module.SOLUTION: A light source module includes a light-emitting diode chip connected electrically with a substrate via the bottom surface, a wavelength conversion part including the emission surface of light of the light-emitting diode chip on one side face thereof, and formed on the light-emitting diode chip while including at least the emission surface, and a reflection part formed on the light-emitting diode chip except the emission surface.
申请公布号 JP2015070273(A) 申请公布日期 2015.04.13
申请号 JP20140196808 申请日期 2014.09.26
申请人 SEOUL SEMICONDUCTOR CO LTD 发明人 NAM KI BUM;JUNG SEOUNG HO;HAN YU DAE;LEE CHUNG HOON;CHOI HYUCK JUNG
分类号 H01L33/60;F21S2/00;G02F1/13357;H01L33/50 主分类号 H01L33/60
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