MAGNETIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, BONDING STRUCTURE BETWEEN MAGNETIC SUBSTRATE AND INSULATING MATERIAL, AND CHIP COMPONENT HAVING THE BONDING STRUCTURE

摘要

A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.

主权项

1. A chip component comprising:
a magnetic substrate having ferrite layers; an insulating layer disposed on the magnetic substrate and having an electrode disposed therein; and an external electrode connected to the electrode on the insulating layer, wherein the magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween, the chemical coupling structure including Si—O—C or Si—O—N.