| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring member, which is adhered to various adherends without using flux and a special device, and a manufacturing method of the wiring member, and to provide a wiring member adhesion body obtained by using the wiring member and a manufacturing method of the wiring member adhesion body.SOLUTION: The invention provides a wiring member including: a conductive material; and a solder coating layer disposed in at least a part of a region on a surface of the conductive material and includes a non-eutectic solder material. |
