Substrate inverting device, substrate inverting method, and peeling system

摘要

According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

主权项

1. A substrate inverting device for inverting front and rear surfaces of a substrate, comprising:
a first holding unit having a first Bernoulli chuck configured to hold a first surface of the substrate; a second holding unit disposed to face the first holding unit, and having a second Bernoulli chuck configured to hold a second surface of the substrate; a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other; and a transfer mechanism having a third Bernoulli chuck configured to hold the second surface of the substrate when transferring the substrate to the first holding unit, and configured to hold the first surface of the substrate when transferring the substrate from the second holding unit.