发明名称 Methods and systems for releasably attaching support members to microfeature workpieces
摘要 Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.
申请公布号 US8999498(B2) 申请公布日期 2015.04.07
申请号 US201313751671 申请日期 2013.01.28
申请人 Micron Technology, Inc. 发明人 Pratt David;Hembree David R.
分类号 B32B3/10;B32B3/22;B32B3/30;B32B7/02;B32B7/12;B32B7/14;B32B37/14;H05K13/00;B23B7/02;H01L21/78;B32B37/12 主分类号 B32B3/10
代理机构 Perkins Coie LLP 代理人 Perkins Coie LLP
主权项 1. An assembly, comprising: a temporary carrier having a plurality of support blocks separated from each other by a plurality of gaps, the individual support blocks having a first side facing toward a microfeature workpiece, a second side opposite from the first side and facing toward the carrier, and side walls extending between the first and the second sides, the support blocks being arranged on a first side of the carrier in a pattern generally corresponding to a die pattern of the microfeature workpiece such that the individual support blocks face corresponding individual dies on the workpiece, wherein a first adhesion of the first side of the support blocks is less than a second adhesion of the second side of the support blocks; and adhesive material disposed in the gaps between the individual support blocks, wherein the adhesive material in the gaps is in contact with portions of the first side of the carrier and the side walls of the support blocks, wherein the first side of the support blocks and an upper surface of the adhesive material in the gaps between the individual support blocks are generally co-planar.
地址 Boise ID US