| 发明名称 |
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A wiring substrate is provided with a support substrate (31), an insulating layer (32), and a wiring layer (33). The support substrate (31) is formed with a hole (34) including an opening portion in one surface of the support substrate (31). The insulating layer (32) is formed on a surface of the support substrate (31) opposite to the one surface thereof including the opening portion. The wiring layer (33) includes a wiring pattern of a predetermined structure on the insulating layer (32). Further, an orthographic projection to be obtained when the wiring pattern is projected on a predetermined surface of the support substrate (31), and an orthographic projection to be obtained when the hole (34) is projected on the predetermined surface of the support substrate (31) include a shared portion. |
| 申请公布号 |
US2015083470(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201414494974 |
申请日期 |
2014.09.24 |
| 申请人 |
NEC Corporation |
发明人 |
TSUCHIDA Junichi |
| 分类号 |
H05K3/10;H05K1/03;H05K3/40;H05K1/11 |
主分类号 |
H05K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring substrate comprising:
a support substrate formed with a hole including an opening portion in one surface of the support substrate; an insulating layer formed on a surface of the support substrate opposite to the one surface including the opening portion; and a wiring layer including a wiring pattern of a predetermined structure on the insulating layer, wherein an orthographic projection to be obtained when the wiring pattern is projected on a predetermined surface of the support substrate, and an orthographic projection to be obtained when the hole is projected on the predetermined surface of the support substrate include a shared portion. |
| 地址 |
Tokyo JP |
