| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrical, mechanical, dynamic and thermal connection between a semiconductor device and a structure on which the semiconductor device is mounted.SOLUTION: A compliant bonding structure is disposed between a semiconductor device and a mount 40. In some embodiments, the device is a light-emitting device. When the semiconductor light-emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light-emitting device, the compliant bonding structure collapses to partially fill the space between the semiconductor light-emitting device and the mount. In some embodiments, the compliant bonding structure is a plurality of metal bumps 32 that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer 46. |
