发明名称 System and Method of Polishing a Surface
摘要 A method of polishing a surface of an object disposed within a gas chamber is provided. The method includes filling the gas chamber with a discharging medium to a predefined pressure, applying a voltage between an electrode and the surface, calibrating a height of the electrode relative to the surface so as to establish electrical breakdown threshold criteria, and scanning the electrode with respect to the surface so as to sequentially position the electrode over a plurality of locations on the surface, each location characterized by a surface error. When a respective location in the plurality of locations has a surface error that meets the electrical breakdown threshold criteria, electrical breakdown occurs, whereby the electrical breakdown results in a discharging pulse that polishes the surface.
申请公布号 US2015076118(A1) 申请公布日期 2015.03.19
申请号 US201314095926 申请日期 2013.12.03
申请人 Hsia Kangmin 发明人 Hsia Kangmin
分类号 B24B1/00;B24B19/22;B23H7/32;H01L21/306;B23H3/00 主分类号 B24B1/00
代理机构 代理人
主权项 1. A method of polishing a surface of an object disposed within a gas chamber, comprising: filling the gas chamber with a discharging medium to a predefined pressure; applying a voltage between an electrode and the surface; calibrating a height of the electrode relative to the surface so as to establish one or more electrical breakdown threshold criteria; and scanning the electrode with respect to the surface so as to sequentially position the electrode over a plurality of locations on the surface, each location characterized by a surface error; wherein when a respective location in the plurality of locations has a surface error that meets the electrical breakdown threshold criteria, electrical breakdown occurs; wherein the electrical breakdown results in a discharging pulse that polishes the surface.
地址 Fremont CA US