| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device in a manufacturing method of the semiconductor device.SOLUTION: A manufacturing method of a semiconductor device includes the steps of: heating a solder bump 23, which connects an electrode 24 of a circuit board 21 with a semiconductor element 32 and contains tin, to a temperature lower than a melting point of the solder bump 23; and removing the semiconductor element 32 from the circuit board 21 after the step where the solder bump 23 is heated. |
