发明名称 |
Power converter, semiconductor device, and method for manufacturing power converter |
摘要 |
This power converter includes a first substrate, a second substrate, a power conversion element, and a case portion, and the case portion includes a first connection terminal connected to a first conductor pattern arranged on a side of the first substrate closer to the power conversion element and a second connection terminal connected to a second conductor pattern arranged on a side of the second substrate opposite to the power conversion element. |
申请公布号 |
US8981552(B2) |
申请公布日期 |
2015.03.17 |
申请号 |
US201213400117 |
申请日期 |
2012.02.20 |
申请人 |
Kabushiki Kaisha Yaskawa Denki |
发明人 |
Shimoike Shoichiro;Yoshimi Daisuke |
分类号 |
H01L23/053;H01L23/049;H01L25/07;H01L23/00;H01L23/498;H01L23/538 |
主分类号 |
H01L23/053 |
代理机构 |
Mori & Ward, LLP |
代理人 |
Mori & Ward, LLP |
主权项 |
1. A power converter comprising:
a first substrate; a second substrate arranged to be opposed to said first substrate; a power conversion element mounted between said first substrate and said second substrate; and a case portion provided to surround said first substrate and said second substrate, wherein said case portion includes a first connection terminal connected to a first conductor pattern arranged on a side of said first substrate closer to said power conversion element and a second connection terminal connected to a second conductor pattern arranged on a surface of a first side of said second substrate opposite to a surface of a second side of said second substrate facing said power conversion element. |
地址 |
Kitakyushu-Shi JP |