SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SAME

摘要

This method for manufacturing a semiconductor substrate is provided with: an element formation step for forming a plurality of element regions in a substrate part; a first wiring step for forming circuit wiring that is connected to the element region; an electrode pad formation step for forming a plurality of electrode pads; a second wiring step for forming potential adjustment wiring that electrically connects at least some of the plurality of electrode pads; an electrode formation step for forming an electrode body on the electrode pad by electroless plating after the second wiring step; and a potential adjustment termination step for terminating the connection by the potential adjustment wiring after the electrode formation step.