发明名称 CONDUCTIVE POWDER, METHOD FOR MANUFACTURING THE SAME, AND CONDUCTIVE PASTE USING THE CONDUCTIVE POWDER
摘要 <p>The present invention relates to a conductive powder having specific resistance similar with silver by coating silver to a plate metal powder (for example, a copper powder), to a manufacturing method thereof, and to a conductive paste using the conductive powder. According to the present invention, the conductive powder (10) comprises the metal powder (10); an intermediate layer (2) formed by a surfactant on the surface of the metal powder; and a silver coating layer (3) formed by a silver precursor on the surface of the intermediate layer, wherein the maximum diameter of the metal powder is 1-10μm, and the thickness is 50 nm-10μm; and the thickness of the silver coating layer is 30 nm-10μm.</p>
申请公布号 KR101499141(B1) 申请公布日期 2015.03.11
申请号 KR20130107298 申请日期 2013.09.06
申请人 DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION 发明人 KIM, IN SOO;KIM, SANG HO
分类号 H01B1/02;H01B1/22 主分类号 H01B1/02
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