发明名称 SURFACE-TREATED COPPER FOIL AND LAMINATED SHEET, PRINTED WIRING BOARD, AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD
摘要 <p>Provided is a surface-treated copper foil with which adhesion with a resin is good and transparency of the resin after the copper foil has been removed by etching is excellent. Also provided is a laminated sheet using the same. The surface-treated copper foil is obtained by performing roughing treatment of at least one surface of the copper foil in order to form roughing particles such that the roughing particles at the roughed surface comprise per unit surface area at least 50 particles/µm2 of roughing particles having a major axis of 100 nm or less, and have a 60-degree glossiness of the MD at the roughed surface of 76 to 350%.</p>
申请公布号 KR20150024393(A) 申请公布日期 2015.03.06
申请号 KR20157000584 申请日期 2013.06.11
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 ARAI HIDETA;MIKI ATSUSHI
分类号 B32B15/08;C25D3/56;C25D3/58;C25D5/10;C25D5/12;C25D5/16;C25D7/06;H05K1/09;H05K3/38 主分类号 B32B15/08
代理机构 代理人
主权项
地址