| 摘要 |
<p>A photosensitive resin composition, a pattern formed by using the composition, and a display device containing the pattern are provided to improve storage stability, pattern shape, surface smoothness, mechanical properties, heat resistance and solvent resistance. A photosensitive resin composition comprises a binder resin which is a copolymer of (A1) an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride, (A2) an aliphatic polycyclic epoxy compound and (A3) a monomer different from (A1) and (A2) and polymerizable with (A1) and (A2); a photopolymerizable compound which contains a compound having an unsaturated double bond equivalence of 120-400 g/eq; a photopolymerization initiator; and a solvent. Preferably the compound having an unsaturated double bond equivalence of 120-400 g/eq is represented by the formula (BA).</p> |
