Flexible metal interconnect structure

摘要

A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.

主权项

1. A flexible metal interconnect structure comprising:
a plurality of spaced-apart first conductive pads disposed in an end-to-end arrangement on a first inner surface of a first flexible material layer such that the plurality of spaced-apart first conductive pads form a first intermittent pathway; a plurality of spaced-apart second conductive pads disposed in an end-to-end arrangement on a second inner surface of a second flexible material layer such that the plurality of spaced-apart second conductive pads form a second intermittent pathway; and a plurality of compliant micro-contact elements disposed in sliding contact between the first and second conductive pads such that each first conductive pad is electrically connected to two adjacent second conductive pads by associated first and second compliant micro-contact elements, whereby an electrical signal transmitted between first and second locations along said flexible metal interconnect structure is alternately transmitted along said first and second intermittent pathways between said first conductive pads and said second conductive pads by way of said plurality of micro-contact elements.