| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an organic semiconductor device having a simplified configuration without an interlayer insulating film.SOLUTION: An organic semiconductor device comprises: an electrode foil including at least a metal foil; an organic semiconductor layer provided partially on a surface of the electrode foil; an upper electrode layer provided on the organic semiconductor layer; an encapsulation layer provided on the electrode foil, the organic semiconductor layer, and the upper electrode layer, and covering exposed parts of the electrode foil, the organic semiconductor layer, and the upper electrode layer; and at least one contact hole provided so as to penetrate through the encapsulation layer, and that enables electrical connection with the upper electrode layer.</p> |
