| 摘要 |
A polishing apparatus is used to polish a workpiece such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, a dresser for dressing the polishing surface, a substrate holder for holding and pressing a substrate against the polishing surface to polish the substrate with relative movement between the polishing surface and the substrate. The dresser includes a first dressing member and a second dressing member. The first dressing member has a circular shape having a diameter larger than a diameter of the substrate. The second dressing member is shaped so as to surround the first dressing member. The first dressing member and the second dressing member are operable to come into contact with the polishing surface independently of each other.
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