| 摘要 |
<p>The invention relates to an electronic device including an electrically insulating body (10), a cavity (11) provided in the body (10), an integrated circuit chip (20) arranged in the cavity, an insulating material (24) for covering said integrated circuit chip, a first electric circuit (12) including at least one first point (13) for electrically coupling to said integrated circuit chip (20), said at least one coupling point (13) being arranged in the cavity (11), and at least one electric pad (14) extends out of the insulating covering material (24), said at least one electric pad (14) constituting an interconnection point for electrically connecting a second electric circuit (31) arranged on one of the surfaces of the body (10). The device is characterized in that the first electric circuit further includes at least one conductive via (15) connecting said at least one coupling point (13) to said interconnection point (14), said interconnection point (14) being arranged on a surface of the body (10) opposite the surface supporting said cavity (11).</p> |
