ULTRA HIGH VOID VOLUME POLISHING PAD WITH CLOSED PORE STRUCTURE

摘要

The invention provides a polishing pad for chemical mechanical polishing comprising a porous polymeric material, wherein the polishing pad comprises closed pores and wherein the polishing pad has a void volume fraction of 70% or more. Also disclosed is a method for preparing the aforesaid polishing pad and a method of polishing a substrate by use of theaforesaid polishing pad.