SOLDER WETTABLE FLANGES AND DEVICES AND SYSTEMS INCORPORATING SOLDER WETTABLE FLANGES

摘要

An embodiment of a solder wettable flange includes a flange body formed from a conductive material. The flange body has a bottom surface, a top surface, sidewalls extending between the top surface and the bottom surface, and one or more depressions extending into the flange body from the bottom surface. Each depression is defined by a depression surface that may or may not be solder wettable. During solder attachment of the flange to a substrate, the depressions may function as reservoirs for excess solder. Embodiments also include devices and systems that include such solder wettable flanges, and methods for forming the solder wettable flanges, devices, and systems.

主权项

1. A solder wettable flange comprising:
a flange body formed from a conductive material and having a bottom surface, a top surface, sidewalls extending between the top surface and the bottom surface, and one or more depressions extending into the body from the bottom surface, wherein each depression is defined by a depression surface.