| 摘要 |
Disclosed is an ultrasonic bonding type metal wire bonding apparatus capable of bonding a wire with an ultrasonic bonding type and inspecting the quality of a wire bonding operation at the same time. The disclosed metal wire bonding apparatus includes: a bonding tool which presses the bonding part of a metal wire to a bonding pad to be closely attached: an ultrasonic vibration horn which is connected to the upper side of the bonding tool and vibrates with an ultrasonic frequency band to bond the bonding part to the bonding pad by vibrating the bonding tool; a wire clamp which clamps the metal wire by gripping the metal wire when the bonding tool is vibrated and the bonding part is closely attached to the bonding pad; a wire cutter which separates the metal wire which is electrically connected from the metal wire which is not electrically connected by cutting the remaining part of the metal wire except the bonding part after the bonding part is bonded to the bonding pad; a deformation detector which detects the cross section deformation value of the bonding part; and a quality determining unit which determines a bonding failure if the cross section deformation value is smaller than a preset cross section deformation reference value. |
