| 摘要 |
<p>Disclosed is a pre-wetting device including a twin fluid nozzle. The device includes: a wafer; a pre-wetting part pre-wetting the wafer by being installed to approach and separate from a chuck rotating at the same place while chucking the wafer; an injecting part injecting gas or liquid for pre-wetting into the wafer in the pre-wetting part; and a spray hole spraying the gas or liquid provided by the injecting part to the wafer, wherein the device includes multiple spray holes in both sides. As spray holes of DI and nitrogen gas are included in both sides of the nozzle, when the DI and nitrogen gas are sprayed at the same time, inertia with high pressure is formed to make an accelerator easily penetrate the surface of the wafer during a plating process so the efficiency of work is improved, and loads of pipes are distributed to reduce risk of damaging the device.</p> |
