发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing method capable of preventing a substrate from being broken.SOLUTION: The polishing method inspects whether a peripheral part of a substrate has an abnormal portion. When an abnormal portion is detected, the substrate is polished. When an abnormal portion is not detected, the substrate is not polished. One example of an abnormal portion of the substrate is a foreign matter such as adhesive adhering to a peripheral part of the substrate. After polishing the substrate, whether a peripheral part of the substrate has an abnormal portion may be inspected again.
申请公布号 JP2015035595(A) 申请公布日期 2015.02.19
申请号 JP20140137776 申请日期 2014.07.03
申请人 EBARA CORP 发明人 KANEUMA TOSHIFUMI;YAGI KEITA
分类号 H01L21/304;B24B37/34;B24B41/06;B24B49/12 主分类号 H01L21/304
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