| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging device which prevents a tact time loss of packaging processing from being generated, as further as possible, when forming an air hole in a film material interposed between a thermal compression bond tool and a chip component.SOLUTION: In the packaging device, the chip component is thermally compression-bonded to a substrate by the thermal compression bond tool holding the chip component via the heat-resistant film member. The thermal compression bond tool includes an adsorption hole for adsorbing and holding the chip component, and punch means is provided for forming the air hole by pushing a needle into the film member at a position opposing the adsorption hole in order to adsorb the chip component to the thermal compression bond tool via the film member. When a maximum value of a rate of expansion of the film member is CEmax, a push-in amount LP of the needle from a surface of the film member is set within a range of 0.5×D×(CEmax+1)<LP<0.8×D×(CEmax+1) with respect to a diameter D of the adsorption hole. |
