| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component to be embedded in a board, which is reduced in dimple deficiency.SOLUTION: A multilayer ceramic electronic component to be embedded in a board includes: first and second internal electrodes 21, 22 stacked on each other with a dielectric layer 11 interposed therebetween; first and second dummy electrodes 23, 24 formed to be coplanar with the first and second internal electrodes 21, 22, respectively, while being spaced apart from each other by a predetermined distance; and first and second external electrodes 31, 32 formed to extend from the first and second end surfaces of the ceramic body 10 to the first and second main surfaces and the first and second side surfaces thereof, respectively. When a length from first and second leads 21a-22b formed in the first and second internal electrodes 21, 22 to ends of the first and second external electrodes 31, 32 formed on the first and second side surfaces of the ceramic body is G, a length up to end surfaces of the ceramic body is BW, and a length from the end surfaces of the ceramic body to the first and second leads 21a-22b is M, 30 μm≤G<BW-M is satisfied. |
