发明名称 |
SILICONE COMPOSITION FOR SEALING SEMICONDUCTOR |
摘要 |
The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25°C of 1 to 1000 mPa€¢s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalyst, wherein a decrease in storage modulus of a cured product thereof from 25°C to 50°C is 40% or more. |
申请公布号 |
EP2716717(A4) |
申请公布日期 |
2015.02.18 |
申请号 |
EP20110866569 |
申请日期 |
2011.11.10 |
申请人 |
MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC |
发明人 |
MOCHIZUKI, KIKUO;TAKAGI, AKIRA |
分类号 |
H01L33/56;C08L83/04 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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