| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric module having a high piezoelectricity in which peeling of a lower electrode is minimized. <P>SOLUTION: The piezoelectric module is formed on a diaphragm in a range where an insulating spacer layer LB is separated from a piezoelectric element layer LP while covering both a region NA where the piezoelectric element layer LP does not exist and the edge EG of a lower electrode layer LL, in a planar spread out of the space between a composite substrate 1 and a wiring board 2, and vertical interval of the composite substrate 1 and wiring board 2 is maintained while fixing the edge EG of the lower electrode layer LL. <P>COPYRIGHT: (C)2012,JPO&INPIT |
