| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate formed body and a laminate substrate each of which is less in dent on the surface abutting on a via hole, has high reliability on strength and is composed of thin layers each layer having ≤30 μm thickness, and to provide a method of manufacturing the laminate substrate. <P>SOLUTION: In the green sheet containing ceramic powder, an organic resin and an organic solvent and having ≤30 μm maximum thickness, the porosity being the content of gaps, where the organic resin and the organic solvent are not present, is ≤10%. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
