发明名称 Optical bus in 3D integrated circuit stack
摘要 An optical bus (130) of an integrated circuit (100) comprises: a polymer waveguide (112), a micromirror (114, 116), and an optical coupler (120). The polymer waveguide (112) is disposed in a via (110) formed through at least one die layer (102, 104, 106) of the integrated circuit (100) comprising an active circuit (210). The micromirror (114) is disposed adjacent to the via (110) and optically coupled to the polymer waveguide (112). The optical coupler (120) is connected to the polymer waveguide (112) to couple the active circuit (210) to the optical bus (130). A stacked integrated circuit (100) is described comprising such an optical bus (130). A method (800) of fabricating a rear 45° micromirror on a silicon substrate that can be used in the optical bus (130) is also described. Furthermore, alignment/lock mechanisms for use in a stacked integrated circuit comprising first and second silicon substrates are described.
申请公布号 US8958667(B2) 申请公布日期 2015.02.17
申请号 US201113808323 申请日期 2011.07.04
申请人 发明人 Kwok Chee Yee;Michael Aron;Xu Yiwei
分类号 G02B6/12;G02B6/42;H01L21/00;G02B6/10;G02B6/43;H01L25/065;H01L21/302 主分类号 G02B6/12
代理机构 Harness, Dickey & Pierce, PLC 代理人 Harness, Dickey & Pierce, PLC
主权项 1. An optical bus of an integrated circuit, comprising: a polymer waveguide disposed in a via formed through at least one die layer of said integrated circuit, said die layer comprising an active circuit; a micromirror disposed adjacent said via and optically coupled to said polymer waveguide in said via; and an optical coupler connected to said polymer waveguide of said via for coupling said active circuit of said die layer to said optical bus.
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