摘要 |
<p>The present invention relates to a deposition device for a thin film. The device for the thin film comprises: a basic material loading unit wherein basic materials are loaded; a basic material transportation unit combined with the basic material loading unit, alternately transferring the basic materials; and a thin film deposition unit depositing the thin film on the basic materials. The thin film deposition unit includes a plurality of plasma modules and an isolation unit arranged between each plasma module, and connects or blocks a lower portion of the plasma occurrence modules adjacent to each other through a descending motion. The thin film is deposited on the basic materials as the basic material transportation unit alternately transfers the basic material loading unit.</p> |