| 发明名称 |
ELECTRONIC DEVICE |
| 摘要 |
An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips. |
| 申请公布号 |
US2015036304(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
US201414326071 |
申请日期 |
2014.07.08 |
| 申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
YAMAUCHI Motoi;KAWACHI Osamu |
| 分类号 |
H05K1/11;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips. |
| 地址 |
Tokyo JP |
