发明名称 POLISHING LIQUID FOR CMP, STORAGE LIQUID AND POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing liquid for CMP which makes it possible to smoothly polish a substrate comprising aluminum material.SOLUTION: This invention relates to a polishing liquid for CMP for polishing a substrate comprising aluminum material, the polishing liquid comprising abrasive grains, at least one benzotriazol compound selected from the group consisting of benzotriazol and benzotriazol derivatives, and a liquid medium.
申请公布号 JP2015021092(A) 申请公布日期 2015.02.02
申请号 JP20130151715 申请日期 2013.07.22
申请人 HITACHI CHEMICAL CO LTD 发明人 HOSAKA DAISUKE;INOUE KEISUKE;ONO YUTAKA
分类号 C09K3/14;B24B37/00;C09G1/02;H01L21/304 主分类号 C09K3/14
代理机构 代理人
主权项
地址