| 摘要 |
<p>The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt% of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23°C) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method. The invention also provides a process for producing an optical semiconductor electronic part, including applying the composition as an encapsulating resin to a substrate with a light-emitting element, thereby molding the encapsulating resin into a lens shape by potting.</p> |
