| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress the adhesion of dew condensation water to an electronic component in a refrigerating device including a cooling member cooling a power module. <P>SOLUTION: In the refrigerating device (10), the cooling member (60) includes a body (61) in which a refrigerant of a refrigerant circuit (20) is made to flow and which is brought into contact with the power module (56) so as to cool the power module (56) by the refrigerant. On the surface of the body (61), an adsorbing layer (65) having an adsorbent is formed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
