REMOVING CONDUCTIVE MATERIAL TO FORM CONDUCTIVE FEATURES IN A SUBSTRATE

摘要

Apparatuses having, and methods for forming, conductive features are described. A hole is formed in a substrate and a conductive material is deposited in the hole. A part of the conductive material that occupies a first lengthwise portion of the hole is removed, and a conductive feature that occupies a second lengthwise portion of the hole remains in the substrate.

主权项

1. A method, comprising:
forming a hole in a substrate, wherein the hole includes a first side feature on an outer edge of the hole, and wherein the first side feature traverses a vertical dimension of the hole; subsequent to forming the hole in the substrate, depositing conductive material into the hole such that the first side feature is substantially filled with the conductive material; and removing a part of the conductive material that occupies a first lengthwise portion of the hole, such that at least one conductive feature that occupies a second lengthwise portion of the hole remains in the substrate, wherein the at least one conductive feature is disposed at least partially within the first side feature.