| 发明名称 |
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS PREPARED USING THE SAME |
| 摘要 |
An epoxy resin composition includes an inorganic filler, an epoxy resin, and a curing agent. The inorganic filler has an average particle diameter D50 from about 2 μm to about 10 μm, an average particle diameter D10 of about 3 μm or less, and an average particle diameter D90 from about 6 μm to about 15 μm. Inorganic filler particles having a particle diameter of about 25 μm or more constitute about 0.1 wt % or less of the inorganic filler. |
| 申请公布号 |
US2015021763(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201414334767 |
申请日期 |
2014.07.18 |
| 申请人 |
Samsung SDI Co., Ltd. |
发明人 |
NA Woo Chul;HAN Seung |
| 分类号 |
H01L23/29;H01L21/56;H01L23/00;C08K7/18 |
主分类号 |
H01L23/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An epoxy resin composition, comprising:
an inorganic filler; an epoxy resin; and a curing agent, wherein: the inorganic filler has an average particle diameter D50 from about 2 μm to about 10 μm, an average particle diameter D10 of about 3 μm or less, and an average particle diameter D90 from about 6 μm to about 15 μm, and in the inorganic filler, inorganic filler particles having a particle diameter of about 25 μm or more constitute about 0.1 wt % or less of the inorganic filler. |
| 地址 |
Yongin-si KR |
