发明名称 SUBSTRATE MANUFACTURING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD
摘要 Disclosed is a substrate manufacturing method that includes: a step for polishing a surface of a material substrate; and a step for forming a planarization film on the surface of the material substrate after polishing the surface of the material substrate.
申请公布号 WO2015008586(A1) 申请公布日期 2015.01.22
申请号 WO2014JP66633 申请日期 2014.06.24
申请人 SONY CORPORATION 发明人 AKASAKA, SHIN;KUMON, SATOSHI;SATOU, KENTAROU;OISHI, YUKI
分类号 G09F9/00;B24B37/00;G09F9/30 主分类号 G09F9/00
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