Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature

摘要

A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.

主权项

1. A circuit board assembly including a heating device operated during a cold startup condition, comprising:
a printed circuit board; a central processing unit (CPU) mounted to the printed circuit board; a thermal transfer device connected to the printed circuit board acting when the CPU is operating to remove heat generated by the CPU; and a heating device operating to heat the thermal transfer device, the heating device energized when a temperature defining a cold startup condition of the CPU or the thermal transfer device is sensed, the heating device inducing heat energy input into the thermal transfer device to heat the thermal transfer device and the CPU to above the temperature of the cold startup condition.