THREE-DIMENSIONAL INTEGRATED CIRCUIT WHICH INCORPORATES A GLASS INTERPOSER AND METHOD FOR FABRICATING THE SAME
摘要
<p>A three-dimensional integrated circuit (3D-IC) which incorporates a glass interposer and a method for fabricating the three-dimensional integrated circuit (3D-IC) with the glass interposer are described herein. In one embodiment, the 3D-IC incorporates a glass interposer which has vias formed therein which are not filled with a conductor that allow for precision metal-to-metal interconnects (for example) between redistribution layers. In another embodiment, the 3D-IC incorporates a glass interposer which has vias and has a coefficient of thermal expansion (CTE) that is different than the CTE of silicon which is 3.2 ppm/° C.</p>
申请公布号
EP2823508(A1)
申请公布日期
2015.01.14
申请号
EP20130711774
申请日期
2013.03.05
申请人
CORNING INCORPORATED;CHEN, YI-AN;LU, YUNG-JEAN;THOMAS, WINDSOR PIPES III
发明人
CHEN, YI-AN;LU, YUNG-JEAN;THOMAS, WINDSOR PIPES III