发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor structure includes a molding compound, a conductive plug, and a cover. The conductive plug is located on the molding compound. The cover is located on a top intersection joint between the conductive plug and the molding compound. The semiconductor structure further includes a dielectric. The dielectric is located on the cover and the molding compound. |
申请公布号 |
KR20150004739(A) |
申请公布日期 |
2015.01.13 |
申请号 |
KR20140078357 |
申请日期 |
2014.06.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
TSAI PO HAO;HUNG JUI PIN;LIN JING CHENG;LEE LONG HUA |
分类号 |
H01L23/28;H01L23/48 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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