| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding material which enables easy printing on an object to be bonded and can suppress generation of a void in a bonding part of objects to be bonded, and a bonding method using the bonding material.SOLUTION: In a bonding material comprising a silver paste containing fine silver particles coated by an organic compound having 8 or less carbon atoms such as hexanoic acid and having an average primary particle diameter of 1-50 nm, silver particles coated by an organic compound such as oleic acid and having an average primary particle diameter of 0.5-4 μm, a solvent comprising 3-7 mass% of an alcohol and 0.3-1 mass% of a triol, a dispersant comprising 0.5-2 mass% of an acid-based dispersant and 0.01-0.1 mass% of a phosphate ester-based dispersant, and 0.01-0.1 mass% of a sintering aid such as a diglycolic acid, the content of the fine silver particles is 5-30 mass%, the content of the silver particles is 60-90 mass%, and the total content of the fine silver particles and the silver particles is 90 mass% or more. |
