发明名称 THERMALLY CONDUCTIVE ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive sheet which is excellent in thermal conductivity and flexibility.SOLUTION: A thermally conductive adhesive sheet of the present invention has an adhesive agent layer A, and has a hardness, measured by an ASKER C hardness meter, of 50 or less. The adhesive agent layer A contains inorganic particles A having a new Mohs hardness of less than 3.1 in a ratio of more than 40 vol.% and not more than 60 vol.% with respect to the total volume (100 vol.%) of the adhesive agent layer A, and contains inorganic particles B having a new Mohs hardness of 3.1 or more in a ratio of not less than 5 vol.% and less than 20 vol.% with respect to the total volume (100 vol.%) of the adhesive agent layer A.
申请公布号 JP2015003984(A) 申请公布日期 2015.01.08
申请号 JP20130129869 申请日期 2013.06.20
申请人 NITTO DENKO CORP 发明人 NAKAYAMA JUNICHI;TERADA YOSHIO;FURUTA KENJI;TOJO MIDORI
分类号 C09J7/00;C09J7/02;C09J9/00;C09J11/00;C09J201/00;H01L23/36 主分类号 C09J7/00
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