发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED FROM THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can have improved chemical resistance while maintaining advantages such as high transparency, and has improved stability in a post-treatment, and a cured film or a flattened film.SOLUTION: The photosensitive resin composition comprises (A) a siloxane polymer having at least one structural unit derived from a silane compound represented by formula (I), (B) an epoxy compound, and (C) a 1,2-quinonediazide compound.SELECTED DRAWING: None |
申请公布号 |
JP2016128901(A) |
申请公布日期 |
2016.07.14 |
申请号 |
JP20150216601 |
申请日期 |
2015.11.04 |
申请人 |
ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD |
发明人 |
HUH GEUN;NA JONG-HO;KWON JIN;LEE EUN-YOUNG |
分类号 |
G03F7/075;C08K5/42;C08L83/04;G03F7/004;G03F7/023;G03F7/20 |
主分类号 |
G03F7/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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