发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED FROM THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can have improved chemical resistance while maintaining advantages such as high transparency, and has improved stability in a post-treatment, and a cured film or a flattened film.SOLUTION: The photosensitive resin composition comprises (A) a siloxane polymer having at least one structural unit derived from a silane compound represented by formula (I), (B) an epoxy compound, and (C) a 1,2-quinonediazide compound.SELECTED DRAWING: None
申请公布号 JP2016128901(A) 申请公布日期 2016.07.14
申请号 JP20150216601 申请日期 2015.11.04
申请人 ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD 发明人 HUH GEUN;NA JONG-HO;KWON JIN;LEE EUN-YOUNG
分类号 G03F7/075;C08K5/42;C08L83/04;G03F7/004;G03F7/023;G03F7/20 主分类号 G03F7/075
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