| 摘要 |
一种层叠式封装件及其制法，该层叠式封装件系包括：第一封装件，系包括：第一封装胶体层；第一电性连接结构，系形成于该第一封装胶体层一侧；复数第一导电柱，系形成于该第一封装胶体层中；及第一半导体晶片，系设于该第一封装胶体层中，且电性连接该第一电性连接结构；以及第二封装件，系堆叠于该第一封装件上，且包括：第二封装胶体层；第二电性连接结构，系形成于该第二封装胶体层上；第二半导体晶片，系设于该第二封装胶体层中，且电性连接该第二电性连接结构；以及复数第二导电柱，系形成于该第二封装胶体层中，该第一导电柱系电性连接该第二导电柱。本发明可容许较多的输入输出(I/O)。; a first electrical connection structure formed on one side of the first encapsulant; a plurality of first conductive columns formed in the first encapsulant; and a first semiconductor chip disposed in the first encapsulant and electrically connection the first electrical connection structure; and a second package stacked on the first package and comprised of a second encapsulant; a second electrical connection structure formed on the second encapsulant; a plurality of second conductive columns formed in the second encapsulant; and a second semiconductor chip disposed in the second encapsulant and electrically connected to the second electrical connection structure; and a plurality of second conductive columns formed in the second encapsulant, wherein the first conductive columns are electrically connected to the second conductive columns to thereby provide a larger number of inputs/outputs. |
