摘要 |
A method of forming a gate construction of a recessed access device includes forming a pair of sidewall spacers laterally over opposing sidewalls of a gate dielectric and elevationally over first conductive gate material. The gate dielectric, the first conductive gate material, and the sidewall spacers are received within a trench formed in semiconductive material. Second conductive gate material is deposited within the semiconductive material trench between the pair of sidewall spacers in electrical connection with the first conductive gate material. Other implementations are disclosed, including recessed access device gate constructions independent of method of manufacture. |