Through-vias and methods of forming the same

摘要

An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.

主权项

1. An integrated circuit structure comprising:
a substrate comprising a front surface and a back surface; a ring penetrating through the substrate; an active region at the front surface of the substrate; a dielectric region encircled by the ring, wherein the ring, the dielectric region, and the substrate comprise different materials; and a through-via penetrating through the dielectric region, with the dielectric region contacting the through-via and the rin wherein the dielectric region is wider at the back surface of the substrate than at the front surface of the substrate.