发明名称 |
Semiconductor light emitting device including substrate having protection layers providing protection against chemicals and method for manufacturing the same |
摘要 |
The present invention provides a compound semiconductor light emitting device including: an Si—Al substrate; protection layers formed on top and bottom surfaces of the Si—Al substrate; and a p-type semiconductor layer, an active layer, and an n-type semiconductor layer which are sequentially stacked on the protection layer formed on the top surface of the Si—Al substrate, and a method for manufacturing the same. |
申请公布号 |
US8916402(B2) |
申请公布日期 |
2014.12.23 |
申请号 |
US201213460486 |
申请日期 |
2012.04.30 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Cho Myong Soo;Park Ki Yeol;Choi Pun Jae |
分类号 |
H01L21/00;H01L33/00;H01L33/40;H01L33/38 |
主分类号 |
H01L21/00 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. A method for manufacturing a compound semiconductor light emitting device comprising the steps of:
sequentially forming an n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a top surface of a growth substrate; preparing an Si—Al substrate having a protection layer on a surface of the Si—Al substrate by forming the protection layer on bottom and top surfaces of the Si—Al substrate; bonding the Si—Al substrate including the protection layer on the surface of the Si—Al substrate to the p-type semiconductor layer; separating the growth substrate from the n-type semiconductor layer; forming a plurality of n-side electrodes on the n-type semiconductor layer; and dicing the n-type semiconductor layer, the active layer, the p-type semiconductor layer, the protection layer, and the Si—Al substrate between the n-side electrodes to be divided into chip units. |
地址 |
Seoul KR |