发明名称 Stress-sensitive micro-electromechanical device and use thereof
摘要 The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter.
申请公布号 US8916944(B2) 申请公布日期 2014.12.23
申请号 US201113583392 申请日期 2011.03.15
申请人 ELMOS Semiconductor AG;Silicon Microstructures, Inc. 发明人 Burchard Bernd;Doelle Michael;Ningning Zhou
分类号 H01L33/00;B81B3/00 主分类号 H01L33/00
代理机构 Shumaker & Sieffert, P.A. 代理人 Shumaker & Sieffert, P.A.
主权项 1. A micro-electromechanical device comprising: a substrate suitable for the production of microelectronic components, in particular a semiconductor substrate; and a micromechanical component integrated into the substrate, the micromechanical component comprising a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space; the bending element comprising at least one web having two side edges, the course of the side edges being defined by depressions introduced into the bending element and adjacent to the side edges, the depressions comprising trenches including side walls and a bottom wall,wherein, to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element, andat least one microelectronic component sensitive to mechanical stresses, the microelectronic component being integrated in the web within the homogenization region of the web.
地址 Dortmund DE