发明名称 Apparatus with wideband earpiece response
摘要 Apparatus includes a housing, a substrate provided within the housing and including a first surface oppositely disposed to a second surface, an earpiece speaker module provided within the housing and including an air displacement component that is configured to move upon application of an electrical signal, the air displacement component having a front surface and a back surface, an acoustic cavity defined within the housing, and a front volume adjacent the front surface of the air moving component. The housing includes an earpiece aperture which is coupled to the earpiece speaker module by an acoustic channel, wherein the first surface of the substrate faces generally towards the earpiece aperture. The second surface of the substrate faces the back surface of the air displacement component. A rear volume is provided between the second surface of the substrate and the earpiece speaker module. The acoustic cavity is coupled via a coupling channel to the rear volume. The rear volume and the acoustic cavity are isolated from the front volume.
申请公布号 US8913738(B2) 申请公布日期 2014.12.16
申请号 US200912459379 申请日期 2009.06.30
申请人 Nokia Corporation 发明人 Qingshan Yao;Kvist Preben
分类号 H04M1/03;H04R1/22 主分类号 H04M1/03
代理机构 Harrington & Smith 代理人 Harrington & Smith
主权项 1. An apparatus, comprising: a housing comprising an earpiece aperture for radiating sound to a user's ear when the apparatus is located adjacent the user's ear; a substrate provided within the housing and comprising a first surface oppositely disposed to a second surface, wherein the first surface of the substrate faces generally towards the earpiece aperture; an earpiece speaker module provided within the housing and comprising an air displacement component that is configured to move upon application of an electrical signal for providing sound, the earpiece speaker module having a front surface and a back surface wherein sound waves propagate from both surfaces, wherein the back surface of the earpiece speaker module faces the second surface of the substrate; an acoustic cavity defined within the housing, the acoustic cavity being connected to the earpiece aperture, wherein the acoustic cavity is coupled via a coupling channel to a rear volume between the second surface of the substrate and the back surface of the earpiece speaker module; a front volume adjacent the front surface of the earpiece speaker module and coupled to an interior of the housing via a second coupling channel, wherein the rear volume and the acoustic cavity are isolated from the front volume; and wherein the earpiece aperture is acoustically coupled to the rear volume by an acoustic channel formed between the rear volume and the earpiece aperture for radiating sound to the user's ear when the sound is generated by the earpiece speaker module; and wherein the substrate comprises a printed wire board, and wherein the earpiece speaker module is electrically coupled to the printed wire board; wherein the apparatus comprises a display panel comprising a display surface and a back surface, and wherein the back surface of the display panel faces the first surface of the substrate; and wherein the coupling of the acoustic cavity to the rear volume is used to control at least one parameter that affects a frequency response of the apparatus.
地址 Espoo FI