COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRIC APPLIANCE, RESIN LAYER, PRODUCTION METHOD FOR COPPER FOIL WITH CARRIER, AND PRODUCTION METHOD FOR PRINTED WIRING BOARD

摘要

Provided is a copper foil with a carrier, in which the peeling strength and the adhesive strength between an ultrathin copper layer and a resin base material is increased without causing the various other properties of the copper foil with a carrier to deteriorate, and without the surface roughness of the ultrathin copper layer of the copper foil with a carrier being increased. Also provided is a production method for the same. The copper foil with a carrier includes, in order, the carrier, an intermediate layer, the ultrathin copper layer, and a roughened layer. The roughened layer comprises roughening particles such that the average value of the diameter averages is 0.05-1.3μm, the average value of the length averages is 0.3-3.0μm, and a value (A) {A = the difference (μm) between the maximum and minimum values of the diameter averages / the average value (μm) of the diameter averages of the roughening particles}, which is the difference between the maximum and minimum values of the diameter averages divided by the average value of the diameter averages, of 0.6 or less.